The laser for Europe’s chips.

We are proud to announce the official launch of STAY2ME, funded by the European Innovation Council and SMEs Executive Agency (EISMEA) through the EIC Pathfinder program.
On 12th and 13th May, our consortium met in Bochum at ZESS | Ruhr-Universität Bochum, bringing together RayVen, Photonics and Ultrafast Laser Science of Ruhr University Bochum CRYTUR, spol. s r.o., LASEA, CNRS, from Germany, France, Czech Republic, and Belgium.

We are developing a groundbreaking laser-based technology enabling a new manufacturing process for Through Silicon Via (TSV) micro-drilling. This innovation supports Europe’s green, digital, and resilient agenda in semiconductor manufacturing — directly contributing to the continent’s strategic autonomy in microelectronics and addressing key EU policy priorities

During the meeting lead by Inka Manek-Hönninger, project leader, we defined the next collaboration steps, as the preparation of first deliverables or a timeline for regular meetings, structuring the project organization.

A special thanks to RayVen and Photonics and Ultrafast Laser Science of Ruhr University Bochum for their warm welcome and the amazing team building activity!
We are looking forward to this exciting journey ahead over the next four years.
Hashtag#EIC Hashtag#Innovation Hashtag#KickOff Hashtag#2µmLaser Ruhr-Universität Bochum
Clara Saraceno Antonin Fajstavr Inka Manek-Hönninger David Bruneel, PhD Celia Millon