€3 million for TSV

🔥 We are thrilled to announce that our project “STAY2ME” financed by the European Innovation Council and SMEs Executive Agency (EISMEA) PATHFINDER OPEN 2025 with an amount of 2.999 M€, part of the European Commission’s most ambitious research program Horizon Group Europe Callcenter, has been launched on 1st April 2026. For the next for years, we aim to develop a groundbreaking and innovative laser-based technology for Through Silicon Via (TSV) micro-drillings.

📅 Next step: Kickoff meeting in Bochum at RayVen, located in ZESS | Ruhr-Universität Bochum on 12th May 2026

🤝 The project is coordinated by CNRSUniversité de Bordeaux

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